电子封装技术(2021级)

作者: 来源: 发布时间:2021-11-24 点击量:

子封装技术专业本科培养

Undergraduate Program for Specialty in Electronics Packaging Technology

一、培养目标

. Program Objective

本专业面向国家集成电路和光电子产业需求,培养身心健康、具有良好的思想品质与职业道德、了解中国国情、拥有国际视野与高度社会责任感,适应社会经济发展需求的富有创新精神的高素质复合型人才。学生系统电子制造科学与工程领域的基础理论及工程应用知识,能够从事集成电路制造、电子封装技术、电子制造装备及电子工艺材料等领域的科学研究、技术开发、设计制造、企业管理等工作。毕业后,经过磨练,能够逐步成长为社会的领军人物。

预期五年以上的毕业生:

1)能够系统应用电子封装技术专业基础理论知识,具有较强的从事相关专业领域科学研究的能力;

2)能够应用电子封装技术专业的技术知识,解决本专业及相关领域的复杂工程问题;

3)具有较强的团队合作意识、沟通与交流能力、社会责任感,能够组织协调及科学管理多学科项目与团队;

4)具有优良的道德品质、科学素质与人文修养,热爱祖国、在工程实践中能够综合考虑伦理、社会与环境、可持续发展等因素;

5)具有良好的终身学习、国际视野及开拓创新意识;

6)具有良好的服务意识,履行社会与公共责任。

This program meets the needs of national emerging strategic industries of Integrated Circuit and Optoelectronic industries. It aims to cultivate high-quality compound talents with innovative spirit, good physical and mental health, good ideological quality and professional ethics, understanding of China's national conditions, international perspective and high sense of social responsibility, and adapting to the needs of social and economic development. The students need to systematically master the basic theory and application knowledge of Electronic Manufacturing Science and Engineering, and can engage in the scientific research, technology development, design and manufacturing, enterprise management of integrated circuit manufacture, electronic packaging, electronic manufacturing equipments and electronic technology materials, etc. After graduation, through hard work and training, the students can gradually grow into a leading figure in society.

Expect students can achieve the following goals after graduated more than five years:

(1) Ability to systematically apply the basic theoretical knowledge of natural sciences and electronic packaging technology, and have a strong ability to engage in scientific research in related fields of specialization;

(2) Ability to apply electronic packaging expertise to solve complex engineering problems in this and other related fields;

(3) Strong teamwork awareness, communication and communication skills, sense of social responsibility, able to organize, coordinate and scientifically manage multidisciplinary projects and teams;

(4) With excellent moral character, scientific quality and humanistic accomplishment, loving of motherland, can comprehensively consider such factors as ethics, society and environment, and sustainable development in engineering practice;

(5) Have a good lifelong learning, international perspective and pioneering and innovative awareness;

(6) Have a good sense of service, fulfill social and public responsibility.

二、基本规格要求

. Learning Outcomes

本专业主要学习电子制造科学与工程和材料工程两个领域的基础理论和应用技术,毕业生应获得如下几个方面的知识和能力:

1)能够将数学、自然科学、工程基础和专业知识用于解决复杂工程问题。

2)能够应用数学、自然科学和工程科学的基本原理,识别、表达、并通过文献研究分析复杂工程问题,以获得有效结论。

3)能够设计针对复杂电子制造工程问题的解决方案,设计满足特定需求的系统、单元(部件)或工艺流程,并能够在设计环节中体现创新意识,考虑法律、健康、安全、文化、社会以及环境等因素。

4)能够基于科学原理并采用科学方法对复杂电子制造工程问题进行研究,包括设计实验、分析与解释数据、并通过信息综合得到合理有效的结论。

5)能够针对复杂电子制造复杂工程问题,开发、选择与使用恰当的技术、资源、现代工程工具和信息技术工具,包括对复杂工程问题的预测与模拟,并能够理解其局限性。

6)能够基于工程相关背景知识进行合理分析,评价电子制造工程实践和复杂电子制造工程问题解决方案对社会、健康、安全、法律以及文化的影响,并理解应承担的责任。

7)能够理解和评价针对复杂电子制造工程问题的工程实践对环境、社会可持续发展的影响。

8)具有人文社会科学素养、社会责任感,能够在工程实践中理解并遵守工程职业道德和规范,履行责任。

9)能够在多学科背景下的团队中承担个体、团队成员以及负责人的角色。

10)能够就复杂工程问题与业界同行及社会公众进行有效沟通和交流,包括撰写报告和设计文稿、陈述发言、清晰表达或回应指令。并具备一定的国际视野,能够在跨文化背景下进行沟通和交流。

11)理解并掌握工程管理原理与经济决策方法,并能在多学科环境中应用。

12)具有自主学习和终身学习的意识,有不断学习和适应发展的能力。

As a student of this program, you will gain:

(1) Able to apply knowledge of mathematics, natural science, engineering fundamentals and expertise to solve complex engineering problems.

(2) Identify, formulate, research on literature and analysis complex engineering problems to reach substantiated conclusions using basic principles of mathematics, natural sciences and engineering sciences.

(3) Find solutions for complex electronic manufacturing engineering problems and design innovative systems, units (components) or processes that meet specific requirements. The solution and design shall factor in legal, health, safety, culture, society, and environmental perspectives.

(4) Conduct investigations of complex electronic manufacturing engineering problems using research-based knowledge and research methods including design of experiments, analysis and interpretation of data, and synthesis of information to obtain reasonable and effective conclusions.

(5) Create, select and apply appropriate techniques, resources, and modern engineering and information analytical tools for complex electronic manufacturing engineering problems, including prediction and simulation of complex engineering problems, and understand their limitations.

(6) Assess appropriately on societal, health, safety, legal and cultural impact and the consequent responsibilities relevant to professional engineering practice and solutions to complex electronic manufacturing engineering problems.

(7) Understand and evaluate the impact of engineering practice on complex electronic manufacturing engineering problems on environmental and social sustainable development.

(8) Apply ethical principles and commit to professional ethics and responsibilities and norms of engineering practice.

(9) Ability to assume the role of individual, team members, and principals in a multidisciplinary team.

(10) Communicate effectively on complex engineering activities with the engineering community and with society at large, such as being able to comprehend and write reports and documentation, make effective presentations, and give and receive clear instructions. Possess a certain degree of global outlook, and be able to communicate across different cultures.

(11) Obtain knowledge and understanding of engineering management principles and economic decision-making, and apply these to work.

(12) Recognize the demand, and have the preparation and ability to engage in independent and life-long learning in the broadest context of technological change.

三、培养特色

. Program Highlights

电子制造工程与材料工程相结合,理论与实际相结合,基础知识与学科前沿相结合。

This program emphasizes on the combination of electronic manufacturing engineering and materials engineering, theory and practice, as well as the basic knowledge and the latest discipline knowledge.

四、主干学科

. Main Disciplines

集成电路科学与工程

Integrated Circuit Science and Engineering

五、学制与学位

. Program Length and Degree

学制:四年

Duration4 years

授予学位:工学学士

Degrees ConferredBachelor of Engineering

六、学时与学分

Ⅵ. Credits Hours and Units

完成学业最低课内学分(含课程体系与集中性实践教学环节)要求:160学分。

其中,专业基础课程、专业核心课程学分不允许用其他课程学分进行学分冲抵和替代。

Minimum Credits of Curricular (Comprising course system and intensified internship practical training)160 credits.

完成学业最低课外学分要求:5学分

Minimum Extracurricular Credits5 credits

1.课程体系学时与学分

Course Credits Hours and Units

课程模块

课程性质

学时/学分

占课程体系学分比例(%)

素质教育通识课程

必修

608/33

20.6

选修

160/10

6.3

学科基础课程

必修

1424/83.75

52.3

专业课程

专业核心课程

必修

152/9.5

6.0

专业选修课程

选修

68/7.25

4.5

集中性实践教学环节

必修

33w/16.5

10.3

合计

2412+33w/160

100

其中,总实验(实践)学时学分

208+33w/22.75

14.2(学时比例28.3

 

Course   Classified

Required   /Elective

Hrs/Crs

Percentage   (%)

Essential-qualities-oriented   Education General Courses

Required

606/33

20.6

Elective

160/10

6.3

Basic-disciplinary   Courses

Required

1424/83.75

52.3

Major-specific   courses

Major-specific   Core Courses

Required

152/9.5

6.0

Major-specific   Electives

Elective

124/7.25

4.5

Practicum   Credits

Required

33w/16.5

10.3

Total

2412+33w/160

100

Practicum   Credits

208+33w/22.75

14.2(学时比例28.3

2. 集中性实践教学环节周数与学分

Practicum Credits

实践教学环节名称

课程性质

周数/学分

占实践教学环节学分比例(%)

军事训练

必修

2/1

6.1

工程训练(一)

必修

4/2

9.1

工程训练(五)

必修

1/0.5

12.1

专业社会实践

必修

1/0.5

3

电子制造工程训练

必修

3/1.5

3

生产实习

必修

3/1.5

9.1

专业课程设计

必修

3/1.5

9.1

毕业设计(论文)

必修

16/8

48.5

合计

33/16.5

100

 

Internship & Practical Training

Required   /Elective

Weeks/Credits

Percentage   (%)

Military   Training

Required

2/1

6.1

Engineering   Training ()

Required

4/2

9.1

Engineering   Training ()

Required

1/0.5

12.1

Professional   Social Practice

Required

1/0.5

3

Engineering   Internship

Required

3/1.5

3

Engineering   Training of Electronic Manufacturing

Required

3/1.5

9.1

Course   Project

Required

3/1.5

9.1

Undergraduate   Thesis

Required

16/8

48.5

Total

33/16.5

100

3. 外学分

Extracurricular Credits

序号

课外活动名称

课外活动和社会实践的要求

课外学分

1

社会实践活动

提交社会调查报告,通过答辩者

2

个人被校团委或团省委评为社会实践活动积极分子者,集体被校团委或团省委评为优秀社会实践队者

2

2

思政课社会实践

提交调查报告,取得成绩

2

3

公益劳动

至少参加公益劳动1

0.5

4

英语及计算机

考试

全国大学英语六级考试

考试成绩达到学校要求者

2

托福考试

90分以上者

3

雅思考试

6.5分以上者

3

GRE考试

300分以上者

3

全国计算机等级考试

获二级以上证书者

2

全国计算机软件资格、水平考试

获程序员证书者

2

获高级程序员证书者

3

获系统分析员证书者

4

5

竞赛

校级

获一等奖者

3

获二等奖者

2

获三等奖者

1

省级

获一等奖者

4

获二等奖者

3

获三等奖者

2

全国

获一等奖者

6

获二等奖者

4

获三等奖者

3

6

论文

在全国性刊物发表论文

每篇论文

2~3

7

科研

视参与科研时间与科研能力

每项

1~3

8

实验

视创新情况

每项

1~3

注:参加校体育运动会获第一名、第二名者与校级一等奖等同,获第三名至第五名者与校级二等奖等同,获第六至第八名者与校级三等奖等同。

No.

Extracurricular   Activities and Social Practice

Requirements

Extracurricular

Credits

1

Activities   of Social Practice

Submit report and pass oral   defense

2

Entitled as Activist by the   Communist Youth League of HUST or Hubei Province;

Membership of the group   which is entitled as Excellent Social Practice Group by the Communist Youth   League of HUST or Hubei Province

2

2

Ideological   and political course Social Practice

Submit a report and   obtain a passing score

2

3

Labor for Public Good

Attend labor for   public good for 1 week at least

0.5

4

Examinations   in English and Computer

CET-6

Students   whose Band-6 exam scores accord our requirements

2

TOEFL

90   Points or Higher

3

IELTS

6.5   Points or Higher

3

GRE

300   Points or Higher

3

National   Computer Rank Examination

Win   certificate of Band-2 or higher

2

National   Computer Software Qualification

Win   certificate of programmer

2

Win   certificate of Advanced Programmer

3

Win   certificate of System Analyst

4

5

Competitions

University   Level

Win   first prize

3

Win   second prize

2

Win   third prize

1

Provincial   Level

Win   first prize

4

Win   second prize

3

Win   third prize

2

National   Level

Win   first prize

6

Win   second prize

4

Win   third prize

3

6

Thesis

Those   whose thesis appears in national publications

Per   piece

2~3

7

Scientific Research

Depending   on both the time spent in and ability demonstrated in scientific research   project

Each   item

1~3

8

Experiments

Depending   on innovative extent

Each   item

1~3

Note: In HUST Sports Meeting, the first and the second prize, the third to the fifth prize, and the sixth prize to the eighth prize are deemed respectively the first prize, the second prize and the third prize of university level.

 

七、主要课程及创新(创业)课程

. Main courses and Innovation (Entrepreneurship) course

(一)主要课

VII-1. Main Courses

微连接原理Fundamentals of Micro-joining、电子制造技术基础 Fundamentals of Electronic manufacturing Technology、半导体工艺技术Semiconductor Manufacturing、电子工艺材料Materials for Electronic Manufacturing、印刷线路板设计Design of Printed Circuit Board、电子制造可靠性与失效分析Reliability and Failure Analysis for Electronic Manufacturing、工程化学Engineering Chemistry、工程力学Engineering Mechanics、材料科学基础Fundamentals of Materials Science、固体电子学基础Fundamentals of Solid Electronics

(二)创新(创业)课程

VII-2. Innovation (Entrepreneurship) Courses

创新意识启迪类课程Orientational Innovation (Entrepreneurship) Course 3学分:材料专业创新创业导论Introduction to Innovation and Entrepreneurship in Materials Science32学时/2学分;学科专业概论 Introduction to Disciplines and Specialties16学时/1学分。

创新能力培养类课程Capacity-building Innovation (Entrepreneurship) Course 6.5学分:电子制造技术基础Fundamentals of Electronic manufacturing Technology48学时/3学分;材料加工工程Material Processing Engineering56学时/3.5学分。

创新实践训练类课程Innovative (Entrepreneurship) Practice Training Course, 2.5学分:专业课程设计Major Related Project24学时/1.5学分;材料精密成形综合实验或电子封装技术工艺综合实验,32学时/1学分。

创新实践训练类课程Innovative (Entrepreneurship) Practice Training Course2.5学分:电子制造工程训练Engineering Training of Electronic Manufacturing24学时/1.5学分;电子产品组装与可靠性综合实验Comprehensive Experiment on Electronic Assembly Technology and Reliability32学时/1学分。

 

八、主要集中性实践教学环节(含专业实验)

practicum moduleexperiments included

军事训练Military Training、工程训练 Engineering Practice、电子制造工程训练Engineering Training of Electronic Manufacturing、专业社会实践Professional Social Practice、生产实习Engineering Internship、专业课程设计Course Project、毕业设计(论文)Undergraduate Thesis

九、教学计划进程表

Course Schedule


院(系):欧洲杯线上买球 专业子封装技

School (Department): School of Materials Science and Engineering  Specialty: Electronic Packaging Technology

课程

类别

Course type

课程

性质

Required/

elective

课程

代码

Course code

课程名称

Course name

学时

Hrs

学分

Crs

其中

Including

设置

学期

Semester

实验

Exp.

上机

Operation

教育通识课

Essential-qualities-oriented Education General Courses

必修
  Required

MAX0021

思想道德修养与法律基础

Morals & Ethics & Fundamentals of Law

40

2.5



1

必修
  Required

MAX0041

中国近现代史纲要
  Survey of Modern Chinese History

40

2.5



2

必修
  Required

MAX0011

马克思主义基本原理
  Basic Principles of Marxism

40

2.5



3

必修
  required


习近平新时代中国特色社会主义思想概论General Introduction to Xi   Jinping New Chinese Socialist Ideology

32

2



3

必修
  Required

MAX0001

毛泽东思想和中国特色社会主义理论体系概论General Introduction to Mao   Zedong Thought and Socialist Theory with Chinese Characteristics

72

4.5



4

必修
  Required

MAX0031

形势与政策
  Situation and Policy

32

2



5-7

必修
  Required

CHI0001

中国语文
  College Chinese

32

2



1

必修
  Required

SFL0001

综合英语(一)

Comprehensive English (Ⅰ)

56

3.5



1

必修
  Required

SFL0011

综合英语(二)

Comprehensive English (Ⅱ)

56

3.5



2

必修
  Required

PHE0002

大学体育(一)
  Physical Education (Ⅰ)

60

1.5



1-2

必修
  Required

PHE0012

大学体育(二)
  Physical Education (Ⅱ)

60

1.5



3-4

必修
  Required

PHE0002

大学体育(三)
  Physical Education (Ⅲ)

24

1



5-6

必修
  Required

RMWZ0002

军事理论

Military Theory

16

1



1

必修
  Required

MASE0011

计算机与程序设计基础(C++)

Fundamental of computer   programming (C++)

48

3


8+

(16)

1

选修

Selective


从不同的课程模块中修读若干课程,总学分不低于10学分(其中,美育教育类课程不低于2学分,以提高学生审美和人文素养)。

General Education Courses (Elective)

160

10



2-8


















课程

类别

Course   type

课程

性质

Required/

elective

课程

代码

Course   code

课程名称

course   name

学时

Hrs

学分

Crs

其中

Including

设置

学期

Semester

实验

Exp.

上机

Operation

学科基础课

Discipline-related General   Courses

必修
  required

MASE0711

学科专业概论(需融入思政教育元素:中华人民共和国成立70年来伟大成就、现阶段面临机遇与挑战等)

Introduction   to Disciplines and Specialties

16

1



1

必修
  Required

MAT0551

分(一)上
  Calculus (Ⅰ)

88

5.5



1

必修
  Required

MAT0531

分(一)下
  Calculus (Ⅰ)

88

5.5



2

必修
  Required

MAT0721

线性代数
  Linear Algebra

40

2.5



1

必修
  Required

MAT0561

函数与变换
  Complex Function and Integral Transform

40

2.5



3

必修
  Required

MAT0591

概率与数理统计

Probability and Mathematics   Statistic

40

2.5



2

必修
  Required

PHY0511

大学物理(一)
  Physics (Ⅰ)

64

4



2

必修
  Required

PHY0521

大学物理(二)
  Physics (Ⅱ)

64

4



3

必修
  Required

PHY0551

物理实验(一)
  Physical Experiments (Ⅰ)

32

1

32


2

必修
  Required

PHY0561

物理实验(二)
  Physical Experiments (Ⅱ)

24

0.75

24


3

必修
  required

MESE0571

机械设计与方法(一)上
  Theory and Method of Mechanical Design (
)

40

2.5


12

1

必修
  required

MESE0581

机械设计与方法(一)下
  Theory and Method of Mechanical Design (
)

32

2

8

24

2

必修
  Required

MASE0631

工程化学
  Engineering Chemistry

32

2



1

必修

required

(两门课程选一
  One of Two

MESE5361

计算机网络技术及应用
  Computer networks Technology and Applications

32

2


8+8

2

MESE5511

数据库技术及应用
  Database System Technology and Applications

32

2


8+8

2

必修
  Required

EEE0701

路理
  Electrical & Magnetic Circuits

40

2.5

6


3

必修
  Required

EIC0641

信号与系
  Signal and System

56

3.5

8


5

必修
  Required

EEE0651

拟电子技三)
  Analogue Electronics
(Ⅲ)

40

2.5

6


4

必修
  Required

EEE5321

数字电路

Digital   Circuit

32

2



5


















 

课程

类别

Course   type

课程

性质

Required/

elective

课程

代码

Course   code

课程名称

course   name

学时

Hrs

学分

Crs

其中

Including

设置

学期

Semester

实验

Exp.

上机

Operation

学科基础课

Discipline-related General   Courses

必修
  Required

CEM0542

工程力学(二)
  Engineering Mechanics

72

4.5

6


3

必修
  required

CEM0561

工程力学实验
  Engineering Mechanics Lab.

16

0.5

12


4

必修
  Required

MASE0681

机械原理
  Theory of Machines and Mechanisms

32

2

4


4

必修
  Required

MESE0621

机械制造技
  Foundation of Mechanical Manufacture

40

2.5

4


4

必修
  Required

EPE2021

工程传热学(一)
  Heat Transfer (Ⅰ)

32

2

2


5

必修
  Required

MASE0681

微机原理
  Principle of Microcomputer

32

2


4

4

必修
  required

MASE5141

材料专业创创业导论

Introduction to Innovation and Entrepreneurship   in Materials Science

32

2



5

必修
  Required

MASE0591

材料科学基
  Fundamentals of Material Science

64

4



4

必修
  Required

MASE0611

材料科学基础实验
  Experiment of Material Science

8

0.25



4

必修
  Required

MASE0641

固体子学基(一)
  Fundamentals of Solid Electronics (Ⅰ)

64

4



4

必修
  Required

MASE0661

子学概
  Foundation of Microelectronics

32

2



4

必修
  Required

MASE5191

子封装技艺综实验
  Comprehensive Experiment on Electronic Packaging Technology

16

0.5



5

必修
  Required

MASE5231

子工材料
  Materials for Electronic Manufacturing

32

2



6

必修
  Required

MASE5181

装与可靠性实验
  Comprehensive Experiment on Electronic Assembly Technology and Reliability

16

0.5

16


6

必修
  Required

MASE5281

装技
  Electronic Assembly technology

24

1.5



6

必修
  Required

MESE5921

MEMS封装技
  MEMS Packaging Technology

24

1.5



6

必修
  Required

MASE0721

算方法与子封装模

Calculation Method and   Electronic Packaging Simulation

32

2

8


6

必修
  Required

EIC5321

测试实验
  Electronic Testing and Experiment Techniques

56

1.75



5


















 

类别

Course type

Required/

elective

课程

代码

Course code

课程名称

Course name

学时

Hrs

学分

Crs

其中

Including

设置

学期

Semester

实验

Exp.

上机

Operation

专业核心

Major- specific   Core Courses

必修
  Required

MASE2011

体工
  Semiconductor Manufacturing

32

2



5

必修
  Required

MASE2181

接原理
  Foundation of Micro-joining

40

2.5



5

必修
  Required

MASE2111

子制造技
  Fundamental of Electronic Manufacturing Technology

48

3



3

必修
  Required

OEI5141

子制造可靠性与失效分析
  Reliability and Failure Analysis for Electronic Manufacturing

32

2



6

专业选

Major-specific Electives



专业选7.75学分)

92

7.75




Elective

MASE5712

印刷线路板设计
  Design of Printed Circuit Board

24

1.5


8+(8)

5

Elective

MASE5681

基板技

Advanced Substrate Technology

24

1.5



6

Elective

MASE5041

CAD

Fundamentals of CAD Technology

32

2


8

5

Elective

MASE5411

激光加工技

Laser Processing Technology

24

1.5



6

选修
  Elective

MASE5071

材料表面工程
  Surface Engineering of Materials

32

2



6

Elective

MASE5251

示技
  Electronic Display Technology

24

1.5



7

Elective

MASE5621

生物芯片技
  Bio-Chip Technology

24

1.5



7

Elective

MASE5061

体照明
  Semiconductor lighting

24

1.5



7

Elective

MASE5781

进电子制造技

Advanced Electronic   Manufacturing Technology

32

2



6

Elective

MASE5861

功率器件封装

Power Components Packaging

24

1.5



7

环节

practical training items

必修
  Required

RMWZ3511

训练
  Military Training

2w

1



1

必修
  Required

ENG3511

工程训练(一)
  Engineering training (Ⅰ)

4w

2



3

必修
  Required

ENG3521

工程训练(五)

Engineering training (V)

1w

0.5



4

必修
  Required

MASE3551

专业社会
  Professional Social Practice

1w

0.5



4

必修
  Required

MASE3511

子制造工程训练

Engineering Training of   Electronic Manufacturing

3w

1.5



5

必修
  Required

MASE3541

产实习
  Engineering Internship

3w

1.5



6

必修
  Required

MASE3561

专业课设计
  Course Project

3w

1.5



7

必修
  Required

MASE3611

毕业设计文)
  Undergraduate Thesis

16w

8



8

十、课程矩阵

XCourse Matrix

本专业毕业要求支撑培养目标实现的矩阵关系如下表。


目标(1

科学研究

目标(2

技术应用

目标(3

合作交流

目标(4

道德修养

目标(5

学习创新

目标(6

服务社会

毕业要求(1

工程知识

M

H




M

毕业要求(2

问题分析

M

H



M


毕业要求(3

设计/开发解决方案

M

H


M

M


毕业要求(4

研究

H

M



M


毕业要求(5

使用现代工具

M

H

L


M


毕业要求(6

工程与社会

L

M


M


H

毕业要求(7

环境和可持续发展


M


H


M

毕业要求(8

职业规范



M

H


M

毕业要求(9

个人和团队



H

M


M

毕业要求(10

沟通



H

M

M


毕业要求(11

项目管理



H


M

M

毕业要求(12

终身学习

M

M



H


本专业课程体系与毕业要求的关联度矩阵如下表。

课程

1

工程知识

2

问题分析

3

设计/开发解决方案

4

研究

5

使用现代工具

6

工程与社会

7

环境和可持续发展

8

职业规范

9

个人与团队

10

沟通

11

项目管理

12

终身学习

思想道德修养与法律基础








H

M

M



中国近现代史纲要







M

H




M

马克思主义基本原理


M




H






H

毛泽东思想与中国特色社会主义理论体系概论




M


H


M





习近平新时代中国特色社会主义思想概论




M


H


M





形势与政策






M


H




M

中国语文








M


H


M

综合英语(一、二)




M

H





H



大学体育(一、二、三)








H

H



M

军事理论






L


M

H



M

微积分(一)上、下

H

H


M









线性代数(一)

H

H


M









复变函数与积分变换

M

H


H









概率论与数理统计

M

H


H









大学物理(一、二)

H

H

M










物理实验(一、二)

H

H

M










计算机与程序设计基础


M

H


H








人文社科类选修课程






H

M


H




机械设计理论与方法(一)上、下



H


H





M



工程力学(二)

H

H

M










工程力学实验

M

H


M









机械原理

H

M

H










机械制造技术基础

H

H

M










计算机网络技术及应用/数据库技术及应用


M

H


H








模拟电子技术(三)

M



H

H








数字电路



H

M

H








电路理论

H

M

H










信号与系统

H

H


M









工程传热学(一)


H

M

H









材料专业创新创业导论


M

M







M

M


工程化学

H

H


M









学科概论



M



M

M



M


M

微机原理

H

M

M










材料科学基础

M





H

H






材料科学基础实验


H

M


H








固体电子学基础(一)

H


M

H









微电子学概论

H

M


H









电子制造技术基础

M



H

H








半导体工艺

H


M

H









微连接原理

M

H


H









电子制造可靠性与失效分析


H

H

M









电子封装技术工艺综合实验


M

H


H








电子产品组装与可靠性综合实验


M

H


H








电子测试与实验技术


M

H


H








MEMS封装技术

H



H

M








电子工艺材料

H




M


H






电子组装技术

H

M

H










计算方法

H


H


M








一般选修课

M






M






军事训练






L


M

H



M

工程训练(一)



H


M



H





工程训练(五)



H


M



H





专业社会实践






H

H

M

M




电子制造工程训练



H



H

H






生产实习






H

H

M

M

M

H

M

专业课程设计


H

H


M

M

M


M




毕业设计(论文)

M

H

H

H

H


M


M

H

M


表注:课程与各项毕业要求关联度的高低分别用“H(高)、M(中)、L(弱)表示。


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