电子封装技术(2019年)

作者: 来源: 发布时间:2021-11-24 点击量:

子封装技术专业本科培养

Undergraduate Program for Specialty in Electronics Packaging Technology

 

一、培养目

. Program Objective

本专业培养系统掌握电子制造科学与工程领域的基础理论及工程应用知识,能够从事集成电路制造、电子封装技术、电子制造装备及电子工艺材料等领域的科学研究、技术开发、设计制造、企业管理等工作,具有国际视野以及适应社会经济发展需求的、富有创新精神的高素质复合型人才。毕业后,经过努力和磨练,能够逐渐成长为社会的领军人才。

This program is aimed to cultivate students with the basic theory and applied knowledge of electronic manufacturing science and engineering, and can engage in the scientific research, technology development, design and manufacturing, enterprise management of integrated circuit manufacture, electronic packaging, electronic manufacturing equipments and electronic technology materials. High-quality, innovative and highly-qualified compound talents who can meet the needs of social and economic development. After graduation, through hard work and training, the students can gradually grow into a leading figure in society.

二、基本格要求

. Learning Outcomes

专业主要学习电子制造科学与工程和材料工程两个域的基用技毕业应获得如下几个方面的知识和能力:

1)能够将数学、自然科学、工程基础和专业知识用于解决复杂工程问题。

2)能够应用数学、自然科学和工程科学的基本原理,识别、表达、并通过文献研究分析复杂工程问题,以获得有效结论。

3)能够设计针对复杂电子制造工程问题的解决方案,设计满足特定需求的系统、单元(部件)或工艺流程,并能够在设计环节中体现创新意识,考虑法律、健康、安全、文化、社会以及环境等因素。

4)能够基于科学原理并采用科学方法对复杂电子制造工程问题进行研究,包括设计实验、分析与解释数据、并通过信息综合得到合理有效的结论。

5)能够针对复杂电子制造工程问题,开发、选择与使用恰当的技术、资源、现代工程工具和信息技术工具,包括对复杂工程问题的预测与模拟,并能够理解其局限性。

6)能够基于工程相关背景知识进行合理分析,评价电子制造工程实践和复杂电子制造工程问题解决方案对社会、健康、安全、法律以及文化的影响,并理解应承担的责任。

7)能够理解和评价针对复杂电子制造工程问题的工程实践对环境、社会可持续发展的影响。

8)具有人文社会科学素养、社会责任感,能够在工程实践中理解并遵守工程职业道德和规范,履行责任。

9)能够在多学科背景下的团队中承担个体、团队成员以及负责人的角色。

10)能够就复杂工程问题与业界同行及社会公众进行有效沟通和交流,包括撰写报告和设计文稿、陈述发言、清晰表达或回应指令。并具备一定的国际视野,能够在跨文化背景下进行沟通和交流。

11)理解并掌握工程管理原理与经济决策方法,并能在多学科境中用。

12)具有自主学身学的意,有不断学和适应发展的能力。

As a student of this program, you will gain:

(1) Able to apply knowledge of mathematics, natural science, engineering fundamentals and expertise to solve complex engineering problems.

(2) Identify, formulate, research on literature and analysis complex engineering problems to reach substantiated conclusions using basic principles of mathematics, natural sciences and engineering sciences.

(3) Find solutions for complex electronic manufacturing engineering problems and design innovative systems, units (components) or processes that meet specific requirements. The solution and design shall factor in legal, health, safety, culture, society, and environmental perspectives.

(4) Conduct investigations of complex electronic manufacturing engineering problems using research-based knowledge and research methods including design of experiments, analysis and interpretation of data, and synthesis of information to obtain reasonable and effective conclusions.

(5) Create, select and apply appropriate techniques, resources, and modern engineering and information analytical tools for complex electronic manufacturing engineering problems, including prediction and simulation of complex engineering problems, and understand their limitations.

(6) Assess appropriately on societal, health, safety, legal and cultural impact and the consequent responsibilities relevant to professional engineering practice and solutions to complex electronic manufacturing engineering problems.

(7) Understand and evaluate the impact of engineering practice on complex electronic manufacturing engineering problems on environmental and social sustainable development.

(8) Apply ethical principles and commit to professional ethics and responsibilities and norms of engineering practice.

(9) Ability to assume the role of individual, team members, and principals in a multidisciplinary team.

(10) Communicate effectively on complex engineering activities with the engineering community and with society at large, such as being able to comprehend and write reports and documentation, make effective presentations, and give and receive clear instructions. Possess a certain degree of global outlook, and be able to communicate across different cultures.

(11) Obtain knowledge and understanding of engineering management principles and economic decision-making, and apply these to work.

(12) Recognize the demand, and have the preparation and ability to engage in independent and life-long learning in the broadest context of technological change.

三、培养特色

. Program Highlights

子制造工程与材料工程相合,理论与实际相结合基础知识与学科前沿相结合。

This program emphasizes on the combination of electronic manufacturing engineering and materials engineering, theory and practice, as well as the basic knowledge and the latest discipline knowledge.

四、主干学科

. Main Disciplines

子制造科学与工程 Electronic manufacturing Science and Engineering

五、学制与学位

. Program Length and Degree

学制:四年

Duration4 years

授予学位:工学学士

Degrees ConferredBachelor of Engineering

六、学与学分

. Credits Hours and Units

完成学最低内学分(含程体系与集中性践教学环节)要求:160学分

Minimum Credits of Curricular (Comprising course system and intensified internship practical training)160 credits.

其中,专业础课程、专业核心程学分不允用其他程学分行学分冲抵和替代。

Major-related basic courses and core courses cannot be covered using credits from other courses in this program.

完成学最低外学分要求:5学分

Minimum Extracurricular Credits5 credits

  1. 程体系学与学分

Course Credits Hours and Units

程模

程性

/学分

程体系学分比例(%)

教育通识课

必修

560/31

19.4

160/10

6.3

学科基础课

必修

1432/84.75

53

专业课

专业核心

必修

152/9.5

5.9

专业选

124/7.75

4.8

集中性践教学环节

必修

34w/17

10.6

2428+34w /160

100

 

Course Classified

Required /Elective

Hrs/Crs

Percentage (%)

Essential-qualities-oriented   Education General Courses

Required

560/31

19.4

Elective

160/10

6.3

Basic-disciplinary Courses

Required

1432/84.75

53

Major-specific   courses

Major-specific Core Courses

Required

152/9.5

5.9

Major-specific Electives

Elective

124/7.75

4.8

Practicum Credits

Required

34w/17

10.6

Total

2428+34w/160

100

2. 集中性践教学环节周数与学分

Practicum Credits

 

 

 

 

 

践教学环节名称

程性

周数/学分

践教学环节学分比例(%)

训练

必修

2/1

5.9

公益劳动

必修

1/0.5

2.9

工程训练1(原金工合并

必修

4/2

11.8

工程训练5实验

必修

1/0.5

2.9

专业社会

必修

1/0.5

2.9

子制造工程训练

必修

3/1.5

8.8

产实习

必修

3/1.5

8.8

专业课设计

必修

3/1.5

8.8

毕业设计文)

必修

16/8

47.1

34/17

100

 

Internship & Practical Training

Required   /Elective

Weeks/Credits

Percentage   (%)

Military   Training

Required

2/1

5.9

Laboring for   Public Benefit

Required

1/0.5

2.9

Engineering   Training 1

Required

4/2

11.8

Engineering   Training 5

Required

1/0.5

2.9

Professional   Social Practice

Required

1/0.5

2.9

Engineering   Internship

Required

3/1.5

8.8

Engineering   Training of Electronic Manufacturing

Required

3/1.5

8.8

Course   Project

Required

3/1.5

8.8

Undergraduate   Thesis

Required

16/8

47.1

Total

34/17

100

3. 外学分

Extracurricular Credits

序号

外活名称

外活和社会践的要求

外学分

1

社会践活

提交社会调查报告,通

2

个人被校委或省委评为社会践活动积极分子者,集体被校委或省委评为优秀社会

2

2

思政社会

提交调查报告,取得成

2

3

算机

全国大学英

达到学校要求者

2

托福考

90分以上者

3

雅思考

6.5分以上者

3

GRE

300分以上者

3

全国算机等

以上证书

2

全国算机格、水平考

程序员证书

2

程序员证书

3

分析员证书

4

4

竞赛

一等

3

二等

2

三等

1

一等

4

二等

3

三等

2

全国

一等

6

二等

4

三等

3

5

在全国性刊物

每篇

2~3

6

科研

参与科研时间与科研能力

1~3

7

实验

视创新情况

1~3

注:参加校体育运第一名、第二名者与校一等等同,第三名至第五名者与校二等等同,第六至第八名者与校三等等同。

No.

Extracurricular Activities and Social   Practice

Requirements

Extracurricular

Credits

1

Activities of Social Practice

Submit report and pass oral defense

2

Entitled as Activist by the Communist Youth League of HUST or   Hubei Province;

Membership of the group which is entitled as Excellent Social   Practice Group by the Communist Youth League of HUST or Hubei Province

2

2

Ideological   and political course Social Practice

Submit a report and obtain a passing   score

2

3

Examinations in English and Computer

CET-6

Students whose Band-6 exam scores   accord our requirements

2

TOEFL

90 Points or Higher

3

IELTS

6.5 Points or Higher

3

GRE

300 Points or Higher

3

National Computer Rank Examination

Win certificate of Band-2 or higher

2

National Computer Software   Qualification

Win certificate of programmer

2

Win certificate of Advanced Programmer

3

Win certificate of System Analyst

4

4

Competitions

University Level

Win first prize

3

Win second prize

2

Win third prize

1

Provincial Level

Win first prize

4

Win second prize

3

Win third prize

2

National Level

Win first prize

6

Win second prize

4

Win third prize

3

5

Thesis

Those whose thesis appears in national   publications

Per piece

2~3

6

Scientific Research

Depending on both the time spent in and   ability demonstrated in scientific research project

Each item

1~3

7

Experiments

Depending on innovative extent

Each item

1~3

Note: In HUST Sports Meeting, the first and the second prize, the third to the fifth prize, and the sixth prize to the eighth prize are deemed respectively the first prize, the second prize and the third prize of university level.

七、主要及创新(创业)课程

. Main courses and Innovation (Entrepreneurship) course

  1. 主要课

    Main Courses

    微连接原理Fundamentals of Micro-joining、电子制造技术基础 Fundamentals of Electronic manufacturing Technology、半导体工艺技术Semiconductor Manufacturing、电子工艺材料Materials for Electronic Manufacturing、印刷线路板设计Design of Printed Circuit Board、电子制造可靠性与失效分析Reliability and Failure Analysis for Electronic Manufacturing、工程化学Engineering Chemistry、工程力学Engineering Mechanics、材料科学基础Fundamentals of Materials Science、固体电子学基础Fundamentals of Solid Electronics

  2. 创新(创业)课程

    Innovation (Entrepreneurship) courses

    创新意识启迪类课程:材料专业创新创业导论、材料学科专业导论

    Orientational Innovation (Entrepreneurship) Course: Introduction to Innovation and Entrepreneurship in Materials ScienceAn Introduction to Discipline Specialty

    创新能力培养类课程:电子制造技术基础

    Capacity-building Innovation (Entrepreneurship) Course: Fundamentals of Electronic manufacturing Technology

    创新实践训练类课程:电子制造工程训练、电子产品组装与可靠性综合实验

    Innovative (Entrepreneurship) Practice Training Course: Engineering Training of Electronic ManufacturingComprehensive Experiment on Electronic Assembly Technology and Reliability

     

八、主要集中性践教学环节(含专业实验

practicum moduleexperiments included

训练Military Training、工程训练 Engineering Practice子制造工程训练Engineering Training of Electronic Manufacturing专业社会Professional Social Practice、生产实习Engineering Internship专业课设计Course Project毕业设计文)Undergraduate Thesis

九、教学程表

Course Schedule


院(系):欧洲杯线上买球 专业子封装技

School (Department): School of Materials Science and Engineering Specialty: Electronic Packaging Technology

类别

Course type

Required/

elective

Course code

程名称

Course name

Hrs

学分

Crs

其中

Including

学期

Semester

实验

Exp.

上机

Operation

教育通识课

Essential-qualities-oriented Education   General Courses

必修
  Required

MAX0021

思想道德修养与法律基

Morals &   Ethics & Fundamentals of Law

40

2.5



1

必修
  Required

MAX0041

中国近代史
  Survey of Modern Chinese History

40

2.5



2

必修
  Required

MAX0011

克思主基本原理
  Basic Principles of Marxism

40

2.5



3

必修
  Required

MAX0001

泽东思想和中国特色社会主体系概

General Introduction to Mao Zedong Thought and Socialist Theory with   Chinese Characteristics

72

4.5



4

必修
  Required

MAX0031

与政策
  Situation and Policy

32

2



5-7

必修
  Required

CHI0001

中国
  College Chinese

32

2



1

必修
  Required

RMWZ0001

事理

Military Theory

16

1



2

必修
  Required

SFL0001

合英(一)

Comprehensive English

56

3.5



1

必修
  Required

SFL0011

合英(二)

Comprehensive English

56

3.5



2

必修
  Required

PHE0001

大学体育(一)
  Physical Education(
)

32

1



1

必修
  Required

PHE0011

大学体育(二)
  Physical Education
()

32

1



2

必修
  Required

PHE0021

大学体育(三)
  Physical Education
()

32

1



3

必修
  Required

PHE0031

大学体育(四)
  Physical Education
()

32

1



4

必修
  Required

NCC0001

算机与程序设计C++)

Fundamental of computer programming (C++)

48

3


8

1

选修

Selective


从不同的程模中修若干程,学分不低于10学分(其中,美育教育类课程不低于2学分,以提高学生审美和人文素养)。

General Education Courses (Elective)

160

10



2-8


必修
  Required

MAT0551

分(一)上
  Calculus (
)

88

5.5



1

必修
  Required

MAT0531

分(一)下
  Calculus (
)

88

5.5



2

必修
  Required

MAT0721

线性代数(一)
  Linear Algebra (
)

40

2.5



1

必修
  Required

MAT0561

函数与变换
  Complex Function and Integral Transform

40

2.5



2


















类别

Course type

Required/

elective

Course code

程名称

course name

Hrs

学分

Crs

其中

Including

学期

Semester

实验

Exp.

上机

Operation

学科基础课

Discipline-related General Courses

必修
  Required

MAT0591

概率与数理统计(三)
  Probability and Mathematics Statistic (
)

40

2.5



3

必修
  Required

PHY0511

大学物理(一)
  Physics (
)

64

4



2

必修
  Required

PHY0521

大学物理(二)
  Physics (
)

64

4



3

必修
  Required

PHY0551

物理实验(一)
  Physical Experiments (
)

32

1

32


2

必修
  Required

PHY0561

物理实验(二)
  Physical Experiments (
)

24

0.75

24


3

必修
  Required

MESE0571

工程制(三)上
  Engineering Graphics (
)

40

2.5



1

必修
  Required

MESE0581

工程制(三)下
  Engineering Graphics (
)

32

2



2

必修
  Required

EEE0701

路理
  Electrical & Magnetic Circuits

40

2.5

6


3

必修
  Required

MASE0631

工程化学
  Engineering Chemistry

32

2



3

必修
  Required

CEM0542

工程力学(二)
  Engineering Mechanics

72

4.5

6


3

必修
  Required

EEE0651

拟电子技(三)
  Analogue Electronics (
)

40

2.5

6


4

必修
  Required

MASE0681

机械原理
  Theory of Machines and Mechanisms

32

2

4


4

必修
  Required

MESE0621

机械制造技
  Foundation of Mechanical Manufacture

40

2.5

4


4

必修
  Required

EPE2021

工程传热学(一)
  Heat Transfer (
)

32

2

2


5

必修
  Required

EIC0641

信号与系
  Signal and System

56

3.5

8


5

必修
  Required

EEE5321

数字
  Digital Circuit

32

2



5

必修
  Required

MASE0681

微机原理
  Principle of Microcomputer

32

2


4

5

必修
  Required

MASE5331

管理与工业工程
  Management and Industrial Engineering

24

1.5



6

必修
  Required

MASE0711

学科概论(需融入思政教育元素:中华人民共和国成立70年来伟大成就、现阶段面临机遇与挑战等)

An Introduction to Discipline   Specialty

16

1



1

必修
  Required

MASE5141

材料专业创创业导论

Introduction to Innovation and Entrepreneurship in Materials Science

32

2



5


















 

 

 

 

类别

Course type

Required/

elective

Course code

程名称

Course name

Hrs

学分

Crs

其中

Including

学期

Semester

实验

Exp.

上机

Operation

学科基础课

Discipline-related General Courses

必修
  Required

MASE0591

材料科学基
  Fundamentals of Material Science

64

4



4

必修
  Required

MASE0611

材料科学基础实验
  Experiment of Material Science

8

0.25



4

必修
  Required

MASE0641

固体子学基(一)
  Fundamentals of Solid Electronics (
)

64

4



4

必修
  Required

MASE0661

子学概
  Foundation of Microelectronics

32

2



4

必修
  Required

MASE5191

电子封装技术工艺综合实验
  Comprehensive Experiment on Electronic Packaging Technology

16

0.5



5

必修
  Required

MASE5231

电子工艺材料
  Materials for Electronic Manufacturing

32

2



6

必修
  Required

MASE5181

电子产品组装与可靠性综合实验
  Comprehensive Experiment on Electronic Assembly Technology and Reliability

16

0.5

16


6

必修
  Required

MASE5281

电子组装技术
  Electronic Assembly technology

24

1.5



6

必修
  Required

MESE5921

MEMS封装技术
  MEMS Packaging Technology

24

1.5



6

必修
  Required

MASE0721

计算方法与电子封装模拟

Calculation Method and Electronic Packaging Simulation

32

2

8


6

必修
  Required

MASE5711

印刷线路板设计
  Design of Printed Circuit Board

32

2


16

5

必修
  Required

EIC5321

电子测试与实验技术
  Electronic Testing and Experiment Techniques

56

1.75



5

专业核心课程 Major- specific Core Courses

必修
  Required

MASE2011

体工
  Semiconductor Manufacturing

32

2



5

必修
  Required

MASE2181

接原理
  Foundation of Micro-joining

40

2.5



5

必修
  Required

MASE2111

子制造技
  Fundamental of Electronic Manufacturing Technology

48

3



3

必修
  Required

OEI5141

电子制造可靠性与失效分析
  Reliability and Failure Analysis for Electronic Manufacturing

32

2



6


















 

 

 

 

 

 

 

 

 

 

 

类别

Course type

Required/

elective

Course code

程名称

Course name

Hrs

学分

Crs

其中

Including

学期

Semester

实验

Exp.

上机

Operation

专业选

Major-specific Electives



专业选7.75学分)

124

7.75




选修

Elective

MASE5041

CAD技术基础 Fundamentals of CAD   Technology

32

2


8

5

选修

Elective

MASE5411

激光加工技术
  Laser Processing Technology

24

1.5



6

选修

Elective

MASE5781

先进电子制造技术

Advanced Electronic   Manufacturing Technology

32

2



6

选修

Elective

MASE5681

先进基板技术
  Advanced Substrate Technology

24

1.5



6

选修

Elective

MASE5351

光电子器件导论
  Introduction of Photo-electronic Device

24

1.5



7

选修

Elective

MASE5251

电子显示技术
  Electronic Display Technology

24

1.5



7

选修

Elective

MASE5621

生物芯片技术
  Bio-Chip Technology

24

1.5



7

选修

Elective

MASE5061

半导体照明
  Semiconductor lighting

24

1.5



7

选修

Elective

MASE5851

功能器件系封装

System   Packaging of Functional Components

24

1.5



7

选修

Elective

MASE5861

功率器件封装

Power   Components Packaging

24

1.5



7

环节

practical training items

必修
  Required

RMWZ3511

训练
  Military Training

2w

1



1

必修
  Required

ENG3511

工程训练1(原金工工合并)
  Engineering training 1

4w

2



3

必修
  Required

ENG3521

工程训练5实验
  Engineering training 5

1w

0.5



4

必修
  Required

MASE3551

专业社会
  Professional Social Practice

1w

0.5



4

必修
  Required

MASE3511

子制造工程训练

Engineering Training of Electronic Manufacturing

3w

1.5



5

必修
  Required

MASE3541

生产实习
  Engineering Internship

3w

1.5



6

必修
  Required

HQJT3511

公益劳动
  Labouring for Public Benefit

1w

0.5



8

必修
  Required

MASE3561

专业课设计
  Course Project

3w

1.5



7

必修
  Required

MASE3611

毕业设计文)
  Undergraduate Thesis

16w

8



8


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